FPA Places Student Interns and Awards Academic Scholarships

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Home > FPA Update

FPA Places Student Interns and Awards Academic Scholarships

In its second year, the FPA Student Flexible Packaging Scholarship/Internship Program has successfully placed packaging school students in summer internships with FPA converter members, and will award academic scholarships to these deserving students.

Established in 2005, the FPA Student Flexible Packaging Scholarship/Internship Program is an integral part of the FPA Student Leadership Initiative, providing career development opportunities for packaging and printing school students. Candidates may apply for internships in a variety of disciplines including packaging, mechanical and electrical engineering, printing, quality control, research, graphics and food science.

Packaging students have been placed in internship positions with FPA members American Packaging Corporation, Pliant Corporation and Technipaq, Inc., and will receive hands-on experience in the flexible packaging plants and facilities of these participating companies.

“The association is proud of the great career experience the FPA Flexible Packaging Scholarship/Internship Program offers to packaging students. These highly popular internships assist in exposing packaging school students to the diversity and innovation of the flexible packaging industry,” commented FPA president, Marla Donahue.

FPA, with assistance from American Packaging Corporation, Pliant Corporation and Technipaq, Inc. will present academic scholarships totaling $9,000 to the student interns at the completion of their summer internship.

For more information on the 2006 FPA Flexible Packaging Scholarship/Internship Program and the FPA Student Leadership Initiative, visit FPA at www.flexpack.org or contact the association at (410) 694-0800.