Developing the Future Leaders of the Industry

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Home > FPA Update

Developing the Future Leaders of the Industry
Marla Donahue, FPA President

In 2005, the association introduced two new programs aimed at fostering the academic and career development of future industry leaders, while introducing packaging and printing school students to the innovative world of flexible packaging.

The Student Flexible Packaging Design Challenge honors the flexible packaging solutions designed and developed by students that advance the use of the flexible packaging. The Academic Scholarship & Internship Program provides students with hands-on internships with FPA converter members and encourages them to pursue careers in the flexible packaging industry.

Over the past two years, the association has awarded more than $21,000 in cash prizes and scholarship funds to students participating in these student-focused initiatives. Both, programs have been received by the flexible packaging industry and academic community with great enthusiasm.

Sharing their Success
Recently, I received an email from Nancy Schuememan, the first place prize winner of FPA’s 2006 Student Flexible Packaging Design Challenge. For her development of an aseptic milk pouch for children, Nancy received $1,000 and an expense paid trip to the 2006 FPA Annual Meeting.

In her email, Nancy expressed her gratitude to the association and its members for the opportunity to participate in the 2006 Student Flexible Packaging Design Challenge and the 2006 FPA Annual Meeting. She explained that her participation in the Annual Meeting “sparked new advances” for both her education and career including trips to several industry trade shows, a full semester of study at the London College of Communication, and plans to earn a masters degree in graphic communication.

It was a pleasure to receive this email from Nancy detailing her experiences and future endeavors. It is also rewarding to see how the these FPA programs have contributed to the success of its participants – the students.

FPA Academic Scholarship & Internship Program Update
In this issue of the FPA Update, we report on the completion of FPA’s 2006 Academic Scholarship & Internship Program. Focusing on student interns Christie Collins from Clemson University, and Rachel Duffy and Andrea Walter from the University of Wisconsin-Stout, the article details their summer internship experiences with FPA converter members American Packaging Corporation, Pliant Corporation and Technipaq, Inc.

During their three-month internships, these students were able to complete hands-on projects and make productive contributions, while learning about the flexible packaging industry. The article provides great insight into how this FPA student program is supporting the academic and career goals of students while fostering the growth of the flexible packaging industry.

The association is proud of what these student focused initiatives have been able to accomplish. The programs introduce packaging school students to the innovative world of flexible packaging, provide “real world” experiences in everyday work environments, create new opportunities and expand career possibilities. We thank the academic community and flexible packaging industry for their participation and support.

For more information on these and additional FPA programs, visit the association at www.flexpack.org, or contact the FPA at (410) 694-0800.