FPA Awards $9,000 in Student Scholarships

Through the 2006 Flexible Packaging Association’s Academic Scholarship & Internship Program, the Flexible Packaging Association has awarded $9,000 in scholarships to Clemson University student Christie Collins, and University of Wisconsin-Stout students Rachel Duffy and Andrea Walter. Each student successfully completed summer internships with FPA converter members American Packaging Corporation, Pliant Corporation and Technipaq, Inc.

A Learning Experience
The internships provided through the FPA Academic Scholarship & Internship Program offer great learning experiences. The work and projects the interns participated in allowed them to explore their career options in the flexible packaging industry.

“My internship at Pliant has expanded my knowledge of flexible packaging at the operational, developmental and corporate level,” commented Christie Collins, an intern at Pliant Corporation and a packaging student from Clemson University. Christie noted that during her internship she was able to watch full scale converting operations and run complex machinery - an experience seldom acquired during undergraduate study.

Rachel Duffy, Technipaq, Inc. intern and a packaging school student from the University of Wisconsin-Stout, explained that the internship allowed her to learn more about her interests and the various positions available in the flexible packaging industry.

“This internship has been a valuable learning experience,” commented Rachel. “After completing my internship, I know that I want to build a career in the medical packaging field.”

Learning about the Industry
Not only are students learning more about their goals and aspirations, but they are gaining a greater knowledge of the industry. The responsibilities and duties associated with the internships assisted the students in acquiring a well-rounded appreciation of the flexible packaging industry.

“The best part of my internship included learning more about the application of graphics to flexible packaging material,” noted Andrea Walker, American Packaging Corporation intern and a packaging student from the University of Wisconsin-Stout. “From receiving artwork to obtaining color keys and proofs, to sending approved items to press and forwarding the finished product to the client, I learned a great deal about the details involved in each step of the process.” 

Major Contributions
While learning more about the flexible packaging industry and gaining valuable experiences, the students made extraordinary contributions to their sponsoring internship companies and the industry.

Jim Fox, director of operations for Technipaq, Inc., noted that Rachel demonstrated “creativity, initiative and a desire to learn” during her internship. Jim also commented that “she attacked every project she was given with professionalism and with a sense of importance.” 

Jeff Koch, operations manager for American Packaging Corporation, commented that “Andrea was a valuable asset to our Graphics Department. While assisting with the daily work load, Andrea made significant contributions to ensuring top quality print jobs were consistently delivered.”

Dr. Sam Sabbagh, product development scientist for Pliant Corporation, noted that “Christie’s experiences and education in packaging science was a tremendous asset to the innovation team. She brought a positive attitude and incredible enthusiasm to work.”  

The Flexible Packaging Association applauds these students on their accomplishments and their outstanding participation in the 2006 FPA Academic Scholarship & Internship Program.

About the FPA Academic Scholarship & Internship Program
Introduced in 2005, the FPA Academic Scholarship & Internship Program combines a summer internship with FPA converter member companies and scholarships valued at $3,000 from the Flexible Packaging Association. For more information visit the association at www.flexpack.org or contact FPA at (410) 694-0800.