Digital Packaging Summit 2026

The Flexible Packaging Association is a sponsoring partner in the 12th annual Digital Packaging Summit, which will host 100 to 115 attendees from November 16-18, 2026, at the Hyatt Regency Coconut Point Resort and Spa in Bonita Springs, FL.

If you are researching and considering digital solutions or expanding existing capabilities, as an FPA member, you should consider attending the event. Qualified executives attend the event at no cost (including travel, hotel, meals/receptions, and an optional golf outing), making it a cost-effective experience.

The event, organized by Packaging Impressions magazine/PRINTING United Alliance, is an invitation-only, hosted event designed for senior managers and business executives. The summit has helped numerous flexible packaging, folding carton, label, and corrugated converters build relationships and acquire the information they need to assess technology options, understand trends in the market, and advance their business and operations.

Four of many reasons you should consider attending the summit include:

• Spending two days learning and networking with “Like-Minded” and “Like-Level” Peers who are dealing with the same issues as you are.
  
  
• A white-glove environment designed to help you connect and share ideas.
  
  
• Participate in an educational program featuring some of the top minds and presenters in the market, your peers, and learning in different session formats.
  
  
• Learning about leading suppliers of products and services designed to advance your business.

As a qualified attendee, you will enjoy the following outstanding benefits:

• Free full participation package that includes travel, hotel, meals, and an optional golf outing, ensuring a cost-effective experience
  
  
• Keynotes from industry-leading analysts and experts
  
  
• User panel discussions on topics critical to your business
  
  
• Application-specific smaller group Case Study presentations
  
  
• Deep-dive application-specific breakout sessions and panels
  
  
• One-on-one meetings with leading suppliers
  
  
• Numerous Peer-to-Peer networking meals and receptions for sharing of ideas

Interested in being a hosted attendee?
Please complete this qualification form: Digital Packaging Summit Qualification Form

If you have any questions, please email Chris Lyons, President/Publisher at Packaging Impressions, clyons@napco.com, or David Pesko, Event Director at dpesko@napco.com. You can also visit www.digitalpackagingsummit.com.