Summer Virtual Internship Program

Summer Virtual Internship Program

The program will kick-off Friday, June 9th and end in late July

The FPA Emerging Leadership Council (ELC) is excited to launch its third annual internship program for Summer 2023. This program is designed to introduce summer interns (individuals joining FPA member companies as summer or part-time hires who are not currently full-time employees) to the flexible packaging industry and create opportunities to network among a community of interns from across fellow FPA member companies.

Program Highlights

For 2023, the program will be facilitated virtually across 2 primary components:

  • Summer Speaker Series: 4 1-hour sessions where business and thought leaders share their perspectives on various topics including the state of the flexible packaging industry, sustainability, career paths, industry trends, and more; and
  • Small Group Sessions: Leaders from the ELC will host biweekly conversations with 6-8 program members to reflect on current events and news from across the industry.

At this time, we are limiting the program to 75 individuals.

  • The internship program will kick off Friday, June 9th and end in late July.
  • Due to the program limitations, we may need to limit capacity to 5 interns per member company. Currently, there is NO cost to participate. Future versions of the program may incur a cost due to an additional in-person component.
  • Only current FPA member companies may reserve seats in the program.
  • Most programming will be held during a 1-hour time slot between 10 a.m. and noon EST on Fridays.
  • The maximum commitment requested of the interns is 1-1.5 hours per week.

Next Steps

Complete the sign-up form by providing the names and e-mail addresses of your interns and lead contact.

The deadline to complete the form is Friday, May 19th. If you need more time, please e-mail us and seats will be held for you.


Please reach out to the following ELC members if you have any questions about the summer internship program: